Direct-to-Chip Cooling
We deliver direct-to-chip cooling across UK data centres, routing coolant to cold plates on the processor to remove heat at source. It bridges air and immersion cooling, supporting NVIDIA H100 and A100 densities without replacing your existing rack infrastructure.
- 0.0kW+
- Draw of a single H100 8-GPU server
- 0kW+
- Rack densities beyond air cooling
- 0–0 weeks
- Typical installation time
- 0W+
- TDP support per chip
Where Air Cooling Stops Working
Most enterprise air-cooling infrastructure was designed for rack densities between 5kW and 15kW. Modern GPU nodes operate well beyond that range. A single NVIDIA H100 server draws over 5.6kW. Once you move to multi-node GPU clusters, rack densities climb past 40kW, and conventional computer room air handlers cannot maintain safe operating temperatures. The result is thermal throttling, reduced throughput, and hardware that is running harder than it should to deliver less than it can.
Direct-to-chip cooling resolves this at the hardware level. Cold plates are fitted directly onto CPUs and GPUs, and coolant is circulated through a manifold system that transfers heat away from the processor before it radiates into the wider rack environment. Thermal design power (TDP) is managed precisely, component temperatures remain stable, and the surrounding air-cooled infrastructure is no longer carrying a load it was not designed for.
What Direct-to-Chip Cooling Delivers
Precision thermal management for UK enterprises running GPU-intensive workloads
Targeted Heat Removal
Cold plates remove heat directly from the processor. No reliance on airflow to manage thermal load.
Higher Rack Density
Support densities beyond 40kW without infrastructure rebuild. Works alongside existing air-cooled environments.
Reduced Mechanical Overhead
Fewer fans, lower airflow needs, reduced CRAC load. Less moving infrastructure means lower maintenance costs.
Compatibility Across Hardware
Validated for NVIDIA H100, A100, AMD EPYC, and Intel Xeon. Cold plates matched to your hardware generation.
Managed Coolant Infrastructure
We manage coolant distribution, manifold installation, leak detection, and scheduled maintenance.
Transition Without Full Commitment
A structured step toward higher density without the operational change of a full immersion migration.
Frequently asked questions
What is direct-to-chip cooling and how does it differ from immersion cooling?
Direct-to-chip cooling uses cold plates mounted on individual processors, with coolant circulated through a closed loop to remove heat at the component level. Immersion cooling submerges entire servers in dielectric fluid. DTC is less disruptive to deploy, works alongside existing air-cooled infrastructure, and is well suited to organisations increasing rack density incrementally. For workloads demanding densities above 100kW per rack, full immersion cooling becomes the more appropriate solution.
Which hardware platforms are supported by Our direct-to-chip cooling?
We support cold plate configurations for NVIDIA H100 and A100 GPU nodes, AMD EPYC processor generations, Intel Xeon Scalable platforms, and custom HPC server builds. A hardware compatibility review is completed before deployment to confirm cold plate fit, manifold routing, and coolant compatibility with your specific configuration.
Does it require changes to my existing rack infrastructure?
In most cases, existing rack infrastructure remains in place. The DTC system adds a coolant distribution unit, manifold, and cold plate assembly alongside your current setup. Our engineers handle all installation, pressure testing, and commissioning. Your air-cooled infrastructure continues operating for lower-density hardware in the same environment.
How long does an installation take?
We complete most direct-to-chip cooling installations within two to three weeks from signed agreement. This covers hardware compatibility review, cold plate fitting, manifold routing, pressure testing, and full commissioning by our on-site engineering team. No extended downtime is required during the installation process.
Can it support future hardware upgrades?
Yes. The coolant distribution infrastructure We install is designed to accommodate next-generation hardware without a full system replacement. Cold plate configurations are updated to match new processor generations as your hardware refreshes, protecting your cooling investment as GPU and CPU thermal design power continue to increase.
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